碳钢无氰镀铜试验研究Research on Cyanide-free Copper Plating on Carbon Steel Surface
马涛;李运刚;
摘要(Abstract)：
研究了电流密度、镀液温度及镀液pH对水溶液法在碳钢表面无氰镀铜时镀层质量、镀层外观及电流效率的影响。结果表明:在电流密度5A/dm2、镀液温度70℃、镀液pH=11条件下,碳钢表面铜镀层平整光亮,电流效率高,并且镀层与碳钢基体结合力良好。
关键词(KeyWords)： 碳钢;无氰;镀铜;电流密度;温度;pH
基金项目(Foundation): 国家自然科学基金资助项目(51474088)
作者(Authors): 马涛;李运刚;
DOI: 10.13355/j.cnki.sfyj.2016.04.020
参考文献(References)：
- [1]殷士龙,章佳伟,韦世强.机械合金化Fe100-xCux体系的结构[J].吉首大学学报(自然科学版),2002,23(1):8-12.
- [2]马晶.电机转子槽用Fe-Cu合金的制备及组织与性能表征[D].哈尔滨:哈尔滨理工大学,2012.
- [3]翁巧银,张洪涛.脉冲电镀法制备泡沫铜[J].湿法冶金,2010,29(3):176-177.
- [4]郭崇武,易胜飞.钢铁件直接焦磷酸盐镀铜工艺研究[J].电镀与精饰,2009,31(8):11-14.
- [5]ARAVINDA C L,MAYANNA S M,MURALIDHARAN V S.Electrochemical behavior of alkaline copper complexes[J].Journal of Chemical Sciences,2000,112(5):543-550.
- [6]MAGANNA S M,MARUTH B N.Non-cyanide alkaline copper plating bath[J].Plating and Surface Finishing,1993(5):45-51.
- [7]DE ALMEIDA M R H,BARBANO E P,DE CARVALHO M F,et al.Electrodeposition of copper-zinc from an alkaline bath based on EDTA[J].Surface and Coatings Technology,2011,206(1):95-102.
- [8]张强,曾振欧,徐金来,等.HEDP溶液钢铁基体镀铜工艺的研究[J].电镀与涂饰,2010,29(3):5-8.
- [9]NIKOLI N D,POPOV K I,PAVLOVI L J,et al.Morphologies of copper deposits obtained by the electrodeposition at high overpotentials[J].Surface&Coatings Technology,2006,201(3):560-566.
- [10]IBANEZ A,FATAS E.Mechanical and structural properties of electrodeposited copper and their relation with the electrodeposition parameters[J].Surface&Coatings Technology,2005,191(1):7-16.
- [11]陈高,杨志强,刘烈炜,等.新型柠檬酸盐镀铜工艺[J].材料保护,2005,38(6):24-26.